Piab (www.piab.com) offers the first functional and manifold-mounted ejector system that is based on COAX MICRO technology, the piCOMPACT10 range. By maximizing the use of compressed air and working at low feed pressure, the COAX ejectors increase reliability and productivity while reducing energy consumption.
Unlike conventional ejectors, the products in the piCOMPACT10 range are lighter and smaller, effectively allowing quick movement in the vacuum systems to optimize production capacity. They are ideal for pick-and-place operations demanding efficient handling of small, heavy parts common in semiconductor, electronics, metal, plastic and medical applications.
Available in four different versions, the piCOMPACT10 range reduces the manufacturer’s energy consumption by 30 percent to 50 percent and delivers three times more vacuum flow compared to similar products. The increased vacuum flow strengthens the ejector’s grip on the product improving pickup speed, reduce waste and minimize product damage. For efficiency gains, the piCOMPACT10 also enables faster release of products from the suction cups to the production line.
The piCOMPACT10 offers manufacturers high levels of safety in production plants by using compressed air at lower pressure while delivering the same level of performance. This makes the vacuum ejectors perfect for handling products in the electronic industry requiring ejectors working at low feed pressure.
“Vacuum ejectors today are essential components for an uncounted number of general manufacturing and automation applications across a wide range of industries, with hundreds of specific product requirements,” said Häla El Sheemy Washbrook, Vice President Marketing and Communication at Piab.
“Energy consumption is a key consideration for manufacturers when looking to reduce costs of a complete vacuum system. Working at low pressures with efficient COAX® technology, the piCOMPACT10 range increases productivity for small product handling applications, saving money and reducing a manufacturers’ carbon footprint.”
